Enclosure & Electronics Cooling, Liquid Cooling and Signaling Solutions

Join Pfannenberg at Process Expo in Chicago

Posted by Marine Vienney on Aug 18, 2015 8:51:11 AM

Process_ExpoCome join us at the Process Expo in Chicago, IL on September 15-18, 2015 to discover the latest Thermal Management and Signaling Solutions dedicated to the food and beverage processing and packaging industry.

During the fair you will have the opportunity to chat with our product specialists about using Pfannenberg's products/solutions to;

  • Save energy and keep your enclosures cool with water. Ideal for high temp/harsh conditions.

  • Gain greater cooling efficiency with our DTS micro-channel enclosure air conditioners

  • Schedule a plant survey utilizing our Pfannenberg Advantage™ program designed to lower your total cost of ownership


Stop by our Booth #3826 !!

Click here to learn more about our solutions!


Topics: North America, Company News & Annoucements